METHOD FOR PRODUCING TIN-INDIUM ALLOY COATED COPPER WIRE

摘要

FIELD: electroplating.;SUBSTANCE: invention relates to the field of electroplating and can be used to obtain copper wire coated with alloys based on tin and indium when soldering and tinning electrical elements, integrated circuits, metal surfaces of printed circuit boards and terminals of electrical radioelements in household equipment, as well as electrodes, shielding elements, photovoltaic modules, cables and wires for various purposes. A method for producing copper wire coated with a tin-indium alloy in an electrolyte containing tin sulfate, sulfuric acid, indium sulfate, characterized in that 1,6-(hexamethylenebis[N,N-dipropyltriethoxysilyl]urea, isopropyl alcohol, glycerin is added to the electrolyte) with the following content of components, g/l: tin sulfate (in terms of metal) 17-35; indium sulfate (in terms of metal) 20-45; sulfuric acid 80-120; 1,6-hexamethylene-bis[N,N-dipropyltriethoxysilyl]urea 0.1-1.0; isopropyl alcohol 10-20 ml/l; glycerin 5-15 ml/l, and the coating is deposited in the mode: temperature, °С 18-35; cathode current density, A/dm2 0.5-7.0; current efficiency,% 80-98, and the content of indium in the alloy is 40.0-52.0 wt.%.;EFFECT: increasing the affinity of the copper wire with the alloy at the microcrystalline level and the adhesive strength of the adhesion of the coating to the copper base, the ability to regulate the thickness of the coating, its physical and mechanical properties.;1 cl, 1 tbl, 1 dwg