METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

摘要

A method for manufacturing a wiring board capable of improving adhesion between a base layer and a seed layer is provided. The base material 10 with a seed layer in which the base layer 12 which has electroconductivity is provided on the surface of the base material 11, and the seed layer 13 containing a metal is provided in the surface of the base layer 12 is prepared. By irradiating the seed layer 13 with laser light, the elements constituting the underlayer 12 and the elements constituting the seed layer 13 are diffused between the underlayer 12 and the seed layer 13 . A diffusion layer 14 is formed. The solid electrolyte membrane 52 is disposed between the anode 51 and the seed layer 13 which is the cathode, and a voltage is applied between the anode 51 and the underlayer 12 to form a surface of the seed layer 13 . A metal layer 15 is formed. Among the underlayer 12 , the portion 12a exposed from the seed layer 13 is removed from the substrate 11 .