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STACKED THERMAL PROCESSING CHAMBER MODULES FOR REMOTE RADIATIVE HEATING IN SEMICONDUCTOR DEVICE MANUFACTURE

机译:用于半导体器件制造中的远程辐射加热的堆叠热处理室模块

摘要

Stacked thermal process chamber module for remote radiative heating of semiconductor device workpieces. A stacked thermal process module may include a stack of thermal process chambers and one or more generators of electromagnetic radiation. The electromagnetic radiation may be transported from a generator remote from the process chambers through one or more waveguides, thereby minimizing the volume and/or cleanroom footprint of the stacked thermal process chamber module. A waveguide may terminate in a process chamber so that electromagnetic radiation delivered during a thermal process may be coupled into one or more materials of the workpiece. The radiative heating process may overcome many of the limitations of thermal process chambers that instead employ a local heat source located within a process chamber.
机译:堆叠热处理室模块,用于半导体器件工件的远程辐射加热。 堆叠的热处理模块可包括一堆热处理室和一个或多个电磁辐射发生器。 电磁辐射可以通过一个或多个波导从远离处理室远程的发电机输送,从而最小化堆叠的热处理室模块的体积和/或洁净室占地面积。 波导可以终止于处理室中,使得在热处理期间输送的电磁辐射可以耦合到工件的一个或多个材料中。 辐射加热过程可以克服热处理室的许多限制,而是使用位于处理室内的局部热源。

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