INNER-LAYER BOARD STRUCTURE FOR LCP SUBSTRATE AND LCP SUBSTRATE

摘要

Disclosed in the present application are an inner-layer board structure for an LCP substrate and the LCP substrate. The inner-layer board structure comprises a base body, wherein the base body is provided with a conductive layer, and the conductive layer is provided with an inner-layer circuit. The base body is exposed out, after at least part of the conductive layer being etched, thereby forming a positioning part capable of being exposed out of the base body on the conductive layer; and the conductive layer at the periphery of the positioning part is connected to the inner-layer circuit. When the inner-layer board structure in the present application is subjected to high-temperature pressing, the deviation trends of the positioning part and the inner-layer circuit are the same, so that the problem that the alignment precision between the inner-layer board structure and an outer-layer board structure is affected due to the dislocation between the positioning part and the inner-layer circuit can be solved, and the performance of the LCP substrate can be improved.