The present invention provides an anti-PID encapsulation adhesive film, a photovoltaic module, and a photovoltaic module manufacturing method. The anti-PID encapsulation adhesive film comprises a base adhesive film layer, an insulating layer, and a conductive layer; the insulating layer is located on one side surface of the base adhesive film layer; the insulating layer has a grid structure; the grid structure comprises grid lines and a plurality of hollow portions defined by the grid lines; the grid lines have a structure corresponding to gaps between cell pieces; the conductive layer comprises a plurality of conductive portions; the conductive portions are arranged in the hollow portions in one-to-one correspondence; the volume resistivity of the conductive portions is less than 100 Ω•cm. According to the encapsulation adhesive film, in actual assembly, the conductive portions are disposed in the hollow portions in one-to-one correspondence, and thus, after the assembly is completed, the cell pieces and the conductive portions correspond in structure and are arranged in one-to-one correspondence; the grid lines are correspondingly arranged below the gaps between the cell pieces. Ions or charges enriched on the surfaces of the cell pieces or passing through the adhesive film can be delivered away by means of the conductive portions, thereby directly eliminating charges causing failure of the passivation layer.
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