MANUFACTURING METHOD FOR INDIUM COLUMN SOLDER JOINT, CHIP SUBSTRATE AND CHIP

摘要

The present application discloses a manufacturing method for an indium column solder joint, a chip substrate and a chip. Said method comprises: coating a first photoresist layer on a substrate; coating a second photoresist layer on the first photoresist layer; using a mask to cover a part of the surface of the second photoresist layer, and underexposing the area of the second photoresist layer that is not covered by the mask, so as to obtain a processed second photoresist layer; developing and fixing the processed second photoresist layer, so as to form an undercut structure on the processed second photoresist layer; etching the first photoresist layer through the undercut structure to form a pattern confinement layer; and depositing an indium material at the position of a defined pattern of the pattern confinement layer to form an indium column solder joint. The present application can avoid the problem of lateral diffusion occurring at the bottom of an indium column, and prevent other positions of the substrate from being affected.