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Surface mount type passive component

机译:表面贴装类型无源元件

摘要

Problem to be solved: to increase the difficulty of mounting passive elements on circuit boards.The surface mount passive component 10 includes a passive element 20 and a size converting portion 40 on which the passive element 20 is mounted.The size converting portion 40 is composed of a body 41, a plurality of first external terminals 44 which are exposed to the device mounting surface 42 of the body 41, and are electrically connected to the element external terminal 30 of the passive element 20, and a plurality of second external terminals 45 exposed on the substrate side mounting surface 43 of the body 41 The connection line 48 electrically connects the first external terminal 44 and the second external terminal 45.The area of the substrate side mounting surface 43 is larger than the area of the first main surface 23 of the passive element 20.The total area of each second external terminal 45 on the substrate side mounting surface 43 is larger than the total area of each external device terminal 30 in the first main surface 23.Diagram
机译:要解决的问题:增加在电路板上安装无源元件的难度。表面安装件被动部件10包括无源元件20和尺寸转换部分40,磁体元件20安装在其上。尺寸转换部分40被组成在主体41中,多个第一外部端子44暴露于主体41的装置安装表面42,并且电连接到无源元件20的元件外部端子30,以及多个第二外部端子45暴露在主体41的基板侧安装表面43上,连接线48电连接第一外部端子44和第二外部端子45.基板侧安装表面43的面积大于第一主表面23的面积无源元件20。基板侧安装表面43上的每个第二外部端子45的总面积大于每个外部DE的总面积第一主表面23.diagram的副终端30

著录项

  • 公开/公告号JP2022002260A

    专利类型

  • 公开/公告日2022-01-06

    原文格式PDF

  • 申请/专利权人 株式会社村田製作所;

    申请/专利号JP20200106718

  • 发明设计人 吉岡 由雅;舟木 達弥;安部 俊輔;

    申请日2020-06-22

  • 分类号H01F27/30;H01F27/29;H01F27/02;H01G4/228;H01G2/10;

  • 国家 JP

  • 入库时间 2022-08-24 23:16:04

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