Thermally Conductive Resin Sheet, Laminated Heat Dissipation Sheet, Heat Dissipation Circuit Board, and Power Semiconductor Device

摘要

Provided is a thermally conductive resin sheet having sufficient withstand voltage performance and excellent moisture absorption reflow tolerance that comprises a resin composition containing a crystalline thermoplastic resin having a melting point of 300° C. or higher and a thermally conductive filler, the thermally conductive filler comprising boron nitride agglomerated particles.;In addition, the thermally conductive resin sheet according to another embodiment of the present invention comprises a resin composition containing 15% by mass or more and 40% by mass or less of a crystalline thermoplastic resin having a melting point of 300° C. or higher and 60% by mass or more and 85% by mass or less of a thermally conductive filler, a thermal conductivity of the thermally conductive resin sheet in the thickness direction at 25° C. being 5.0 W/m·K or more.