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UNIFIED MATERIAL-TO-SYSTEMS SIMULATION, DESIGN, AND VERIFICATION FOR SEMICONDUCTOR DESIGN AND MANUFACTURING

机译:半导体设计和制造的统一材料到系统仿真,设计和验证

摘要

A complete, unified material-to-systems simulation, design, and verification method for semiconductor design and manufacturing may include evaluating effects of semiconductor material or process changes on software algorithms. The method may include generating primitive circuit structures using the material or process changes; performing an electrical characterization of the primitive circuit structures; providing an output of the electrical characterization to a script to generate compact models; generating a digital system based on the compact models; and evaluating a performance of a software algorithm on the digital system to determine an effect of the material or process change for the semiconductor manufacturing process.
机译:半导体设计和制造的完整统一的材料到系统仿真,设计和验证方法可以包括评估半导体材料或过程变化对软件算法的影响。 该方法可以包括使用材料或工艺变化产生原始电路结构; 执行原始电路结构的电学表征; 为脚本提供电气表征的输出以产生紧凑型号; 基于紧凑型模型生成数字系统; 并评估数字系统上软件算法的性能,以确定半导体制造工艺的材料或过程变化的效果。

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