METHOD FOR MONITORING A LASER SOLDERING PROCESS, AND LASER SOLDERING SYSTEM USING A SPECTROSCOPE DEVICE

摘要

The invention relates to a laser soldering system (10) and to a method for monitoring a laser soldering process using a monitoring device (13) of the laser soldering system (10). A soldering globule (21) is dispensed onto a substrate (19) surface (20) which can be soldered by means of a soldering globule feed device (11) of the laser soldering system (10), and the soldering globule (21) is at least partly melted by a laser device of the laser soldering system (10). During the laser soldering process, a light signal (23) is produced which is detected by an optical detection device (14) of the monitoring device (13), wherein the light signal (23) is separated into a spectrum of the light signal (23) by a spectroscope device (15) of the monitoring device (13), and the spectrum is analyzed by a processing device (16) of the monitoring device (13). A quality of the spectrum is used to detect whether a burning (22) of the substrate has occurred or not during the laser soldering process.