DIP plate with variable cavity depth and method for dipping contact connections of electronic components

摘要

DIP plate (1) for a DIP process for wetting contact connections (2) of an electronic component (3) with a flux (F), comprising a base body (4) with an upper side (5) and an underside (6) as well at least one recess (7) open to the top (5), the recess (7) extending from the top (5) in the direction of the underside (6), the recess (7) at least partially as a cavity (8) for receiving of the flux (F), characterized in that a cavity plate (9) of the DIP plate (1) can be arranged at least partially in the at least one recess (7), the at least one cavity (8 ) can be limited to the underside (6) of the base body (4), the cavity plate (9) being movable at least along a route section (S) of a route that extends from the top (5) to the bottom (6), wherein the DIP plate (1) has a stop element (11), and that the cavity plate (9) is arranged on the base body (4) in such a way that the stop element (11) can be contacted by moving the base body (4) in such a way that the cavity plate (9) moves relative to the base body via the stop element (11) (4) can be brought about.