Epoxy compound, curable composition, cured product, method for preparing epoxy compound and reactive diluent

摘要

A monoepoxy compound of the following formula (1), a curable composition comprising the same, a cured product thereof, a method for producing the monoepoxy compound, and a reaction diluent comprising the monoepoxy compound are disclosed. When the monoepoxy compound of formula (1) is contained in the curable composition, it is useful in that it can reduce the viscosity of the curable composition while preventing the decrease in heat resistance of the curable composition and weight loss when the curable composition is cured do. (Wherein, R 1 to R 6 are each independently selected from the group consisting of hydrogen, an alkyl group, and an alkoxy group.)