首页>
外国专利>
Multi-Stage Decoupling Networks Integrated with On-Package Impedance Matching Networks for RF Power Amplifiers
Multi-Stage Decoupling Networks Integrated with On-Package Impedance Matching Networks for RF Power Amplifiers
展开▼
机译:多级解耦网络与RF功率放大器的封装阻抗匹配网络集成
展开▼
页面导航
摘要
著录项
相似文献
摘要
An electronic package houses one or more RF amplifier circuits. At least one of an input or output impedance matching network integrated on the package and electrically coupled to the gate or drain bias voltage connection, respectively, of an amplifier circuit, includes a multi-stage decoupling network. Each multi-stage decoupling network includes two or more decoupling stages. Each decoupling stage of the multi-stage decoupling network includes a resistance, inductance, and capacitance, and is configured to reduce impedance seen by the amplifier circuit at a different frequency below an operating band of the amplifier circuit. Bias voltage connections to the impedance matching circuits may be shared, and may be connected anywhere along the multi-stage decoupling network.
展开▼