Manufacture of all-in-one chip-on-board type light emitting device for low level laser therapy(LLLT) and medical light emitting device using it

摘要

The method for manufacturing an integrated chip-on-board type medical light emitting device for low-power laser therapy (LLLT) according to the present invention comprises the steps of assembling a circuit board part to prepare a circuit board part manufactured by mounting at least one light emitting chip on a board body; , A cover member forming step of forming a cover member provided to cover the light emitting surface, which is a surface to which the light emitting chip is coupled to the substrate body, and provided to have an accommodating space therein for accommodating the light emitting chip, the cover; A filling material injection step proceeding to form a filling material filling zone by injecting a filling material having a predetermined viscosity into the inside of the cover member manufactured through the member forming step, and a filling material filling zone formed in the cover member through the filling material injection step, An integration step in which the circuit board part is impregnated and coupled to the light emitting chip, and proceeds to fill the space between the circuit board part and the cover member through the filling material, so that a gap is not generated between the filling material and the cover member It is characterized in that it includes. In addition, the integrated chip-on-board type medical light emitting device according to the present invention is a medical light emitting device for low-power laser therapy (LLLT), which is provided so that light can pass through while retaining a predetermined thickness A light transmitting portion, an exposed surface formed on the lower surface of the light transmitting portion to be exposed to the outside, and a cover member provided to form a receiving space of a predetermined capacity, and a filling material receiving space provided to be filled in a predetermined amount on the receiving space of the cover member A filling material provided to form a substrate body and a substrate body provided to have an accessible area on the receiving space of the cover member, and at least one light emitting chip is provided to be attached to the bottom surface of the substrate body, the light emitting chip is the filling material and a circuit board portion provided so that the bottom surface of the substrate body is in close contact with the surface of the filling material while impregnated therein, wherein the filling material fills the space between the circuit board portion and the cover member, and the filling material and the cover It is characterized in that it is filled in the accommodation space of the cover member so as not to generate a gap between the members.