Chip on film, display device, method of fabricating chip on film, device for fabricating chip on film

摘要

The chip-on-film base substrate; a lead wire disposed on the base substrate; and a driving chip connected to the lead wiring, wherein the lead wiring includes a first lead portion having a first thickness, and a second thickness disposed between the first lead portion and the driving chip and having a greater thickness than the first thickness. and a second lead part having a , wherein the second lead part is connected to the driving chip, and the first lead part and the second lead part include the same material.