THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDING, METHOD FOR MANUFACTURING PLATED RESIN MOLDING, AND METHOD FOR MANUFACTURING PORTABLE ELECTRONIC DEVICE PART

摘要

Provided is a thermoplastic resin composition capable of yielding a resin molding well suppressed from warping after heating, while successfully maintaining high mechanical strength, and such resin molding. Provided is a thermoplastic resin composition containing LDS and capable of yielding a resin molding on which a plating layer can be formed, and, well suppressed from warping after heating while successfully maintaining high mechanical strength, such resin molding, and methods for manufacturing a plated resin molding and a portable electronic device part. The thermoplastic resin composition containing 10 to 100 parts by mass of a reinforcing filler, per 100 parts by mass of a crystalline thermoplastic resin, the reinforcing filler containing a reinforcing fiber and a glass flake having a thickness of 0.1 to 2 µm, with reinforcing fiber/glass flake, which is mass ratio of the reinforcing fiber and the glass flake, adjusted to 0.1 to 1.