Machine learning enhanced optical-based screening for in-line wafer testing

摘要

A method for machine learning enhanced optical-based screening for in-line wafer testing includes receiving optical spectra data for a wafer-under-test by performing scatterometry on the wafer-under-test, performing predictive model screening by applying a predictive model based on the optical spectra data, determining whether a device associated with the wafer-under-test is defective based on the predictive model screening, and if the device is determined to be defective, dynamically modifying a yield map associated with the wafer-under-test, including reassigning at least one die.