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Semiconductor crystal manufacturing equipment management method, semiconductor crystal manufacturing method, and semiconductor crystal manufacturing management system

机译:半导体晶体制造设备管理方法,半导体晶体制造方法和半导体晶体制造管理系统

摘要

PROBLEM TO BE SOLVED: To reduce quality variation of a semiconductor crystal between devices and batches by managing each physical property value of a constituent member of a semiconductor crystal manufacturing device. SOLUTION: In this management method, a heat transfer simulation is performed using a plurality of calculation conditions created by changing each physical property value of each constituent member within a range in which the temperature distribution in the device can be calculated, and the temperature distribution in the device is calculated. The calculation result of the temperature distribution in the target area for suppressing the variation of the temperature distribution and the multiple data sets consisting of multiple calculation conditions are used as training data, the input is each physical property value of each component, and the output is the temperature of the target area. The first estimation model to be the distribution is created by the machine learning method, each physical property value of each component is changed within the range that can vary, and it is input to the first estimation model, the temperature distribution of the target area is estimated, and the estimated target. The permissible range of each physical property value of each component is calculated based on the temperature distribution of the region and the temperature distribution of the target target area, and each configuration is compared with each measured value and the permissible range of each physical property value of each component. Decide whether or not to replace the parts. [Selection diagram] FIG. 5
机译:要解决的问题:通过管理半导体晶体制造装置的构成构件的每个物理性能来降低装置和批次之间的半导体晶体的质量变化。解决方案:在该管理方法中,使用通过通过改变可以计算设备中的温度分布的范围内的每个组成构件的每个物理性质而产生的多个计算条件来执行传热模拟。计算设备。用于抑制温度分布变化的目标区域中的温度分布的计算结果和由多个计算条件组成的多个数据集用作训练数据,输入是每个组件的每个物理属性值,输出是目标区域的温度。作为分布的第一估计模型由机器学习方法创建,每个组件的每个物理属性在可以变化的范围内更改,并且输入到第一估计模型,目标区域的温度分布是估计和估计的目标。基于区域的温度分布和目标目标区域的温度分布,将每个配置与每个测量值和每个物理性质的允许范围进行比较每个配置的允许范围。每个组件。决定是否更换零件。 [选择图]图。 5.

著录项

  • 公开/公告号JP2021187718A

    专利类型

  • 公开/公告日2021-12-13

    原文格式PDF

  • 申请/专利权人 株式会社SUMCO;

    申请/专利号JP20200096513

  • 发明设计人 横山 竜介;藤原 俊幸;

    申请日2020-06-02

  • 分类号C30B15/20;C30B29/06;

  • 国家 JP

  • 入库时间 2022-08-24 22:46:47

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