Its application to thermal gap fillers and battery management systems

摘要

(A) an organopolysiloxane containing an alkenyl group and (B) an organohydrogenpolysiloxane having an average of 2 to 4 silicon-bonded hydrogens, wherein the component (B) is 1 mol of the alkenyl group in the component (A). Organohydrogenpolysiloxane, (C) hydrosilylation reaction catalyst, and (D) heat, 0.2-5 mol per, and at least two of the silicon-bonded hydrogen atoms are located on the side chain of the molecule. A thermally conductive silicone composition comprising a conductive filler, (E) an alkoxysilane having an alkyl group containing 6 or more carbon atoms in a molecule, and (F) glass beads. A heat conductive member is manufactured from the present heat conductive silicone composition. The electronic device has a heat conductive member, and a method for manufacturing the electronic device includes using a heat conductive silicone composition. [Selection diagram] None