THERMAL GAP FILLER AND ITS APPLICATION FOR BATTERY MANAGEMENT SYSTEM

摘要

A thermally conductive silicone composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpoly siloxane having an average of two to four silicon-bonded hydrogen mponent (B) is 0.2 to 5 moles per mole of the alkenyl groups in component (A), and at least two of the silicon-bonded hydrogen atoms are located on the side chains of the molecule; (C) a hydrosilylation reaction catalyst; (D) a thermally conductive filler; (E) an alkoxysilane having an alkyl group containing 6 or more carbon atoms in a molecule; and (F) glass beads. A thermally conductive member is produced from the thermally conductive silicone composition. An electronic device has the thermally conductive member and a manufacturing method of the electronic device includes using the thermally conductive silicone composition.