RESIN COMPOSITION FOR WIRING BOARD MATERIAL, AND PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD IN WHICH SAID RESIN COMPOSITION IS USED

摘要

One aspect of the present invention pertains to a resin composition for a wiring board material including a thermosetting resin and a thermally expandable microcapsule, wherein the dielectric constant (10 GHz) of a cured product of said resin composition is greater than 1.0 and no more than 2.2.