首页> 外国专利> Bonding tool and its manufacturing method, as well as bonding equipment and bonding method

Bonding tool and its manufacturing method, as well as bonding equipment and bonding method

机译:粘接工具及其制造方法,以及粘接设备和粘接方法

摘要

The bonding tool of the present disclosure includes a main body portion and a pressing portion connected to the main body portion, and the pressing portion includes a plurality of first grooves and a tip surface having a plurality of second grooves intersecting the first grooves. It is equipped with a slope connecting to the tip surface, and the difference between the cutting level at a load length rate of 25% on the roughness curve of the tip surface and the cutting level at a load length rate of 75% on the roughness curve. The cutting level difference (Rδc) in the roughness curve representing the above is 0.15 μm to 2 μm. [Selection diagram] Fig. 3
机译:本公开的键合工具包括主体部分和连接到主体部分的压制部分,并且按压部分包括多个第一凹槽和具有与第一凹槽交叉的多个第二凹槽的尖端表面。 它配备有连接到尖端表面的斜率,并且在尖端表面的粗糙度曲线上以25%的负载长度速率与粗糙度的切割水平的差值为75%,粗糙度为75% 曲线。 表示上述粗糙度曲线中的切割水平差(RΔC)为0.15μm至2μm。 [选择图]图3

著录项

  • 公开/公告号JPWO2020158621A1

    专利类型

  • 公开/公告日2021-12-02

    原文格式PDF

  • 申请/专利权人 京セラ株式会社;

    申请/专利号JP20200569587

  • 发明设计人 太田 翔一;三垣 俊二;

    申请日2020-01-24

  • 分类号H01L21/603;

  • 国家 JP

  • 入库时间 2022-08-24 22:35:30

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号