首页> 外国专利> GRINDING METHOD OF BONDED WORKPIECE OBTAINED BY BONDING TRANSPARENT COMPONENTS OR SEMITRANSPARENT COMPONENTS TO EACH OTHER

GRINDING METHOD OF BONDED WORKPIECE OBTAINED BY BONDING TRANSPARENT COMPONENTS OR SEMITRANSPARENT COMPONENTS TO EACH OTHER

机译:通过将透明成分或半透明组分彼此粘合而获得的粘合工件的研磨方法

摘要

A grinding method includes a step of imaging a bonded workpiece by a camera in such a manner as to include the outer circumference of a workpiece and the outer circumference of a support component with a larger diameter than that of the workpiece before a step of holding the support component of the bonded workpiece by a holding surface. The grinding method also includes a step of recognizing the outer circumference of the support component and the outer circumference of the workpiece on the basis of the brightness difference between pixels adjacent to each other in a taken image and a step of recognizing the center of the support component from the recognized outer circumference of the support component and recognizing the center of the workpiece from the recognized outer circumference of the workpiece.
机译:研磨方法包括通过照相机成像粘合工件的步骤,以便包括工件的外圆周和支撑部件的外圆周,其在持有的步骤之前的工件比工件更大的直径。 通过保持表面支撑粘合工件的组件。 研磨方法还包括基于拍摄图像中彼此相邻的像素之间的亮度差,以及识别支撑件中心的步骤,包括识别支撑部件的外周和工件的外周的步骤。 来自支撑部件的识别外圆周的部件,并从工件的识别外圆周识别工件的中心。

著录项

  • 公开/公告号US2021370465A1

    专利类型

  • 公开/公告日2021-12-02

    原文格式PDF

  • 申请/专利权人 DISCO CORPORATION;

    申请/专利号US202117243839

  • 发明设计人 NOBUYUKI FUKUSHI;

    申请日2021-04-29

  • 分类号B24B49/12;B24B41/06;B24B7/22;

  • 国家 US

  • 入库时间 2022-08-24 22:35:04

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