首页> 外国专利> GRINDING PROCESS FOR A CONNECTED WORKPIECE OBTAINED BY CONNECTING TRANSPARENT COMPONENTS OR SEMITRANSPARENT COMPONENTS

GRINDING PROCESS FOR A CONNECTED WORKPIECE OBTAINED BY CONNECTING TRANSPARENT COMPONENTS OR SEMITRANSPARENT COMPONENTS

机译:通过连接透明部件或半透明组分获得的连接工件的研磨工艺

摘要

A grinding method includes a step of imaging a connected workpiece by a camera in such a manner that the outer periphery of a workpiece and the outer periphery of a supporting component having a larger diameter than that of the workpiece before a step of supporting the supporting component include the connected workpiece by a holding surface is. The grinding method also includes a step of recognizing the outer periphery of the supporting component and the outer periphery of the workpiece based on the brightness difference between adjacent pixels in a captured image and a step of recognizing the center of the supporting component from the recognized outer periphery of the supporting component and recognizing the center of the workpiece from the recognized outer circumference of the workpiece.
机译:研磨方法包括通过相机成像连接的工件的步骤,使得工件的外周和支撑部件的外周具有比在支撑支撑部件的步骤之前具有比工件更大的支撑部件的外周 通过保持表面包括连接的工件。 研磨方法还包括基于捕获图像中的相邻像素之间的亮度差来识别支撑部件的外周和工件的外周的步骤,以及从识别的外部识别支撑部件的中心的步骤 支撑部件的周边并识别工件的中心从工件的识别的外圆周。

著录项

  • 公开/公告号DE102021205152A1

    专利类型

  • 公开/公告日2021-12-02

    原文格式PDF

  • 申请/专利权人 DISCO CORPORATION;

    申请/专利号DE202110205152

  • 发明设计人 NOBUYUKI FUKUSHI;

    申请日2021-05-20

  • 分类号H01L21/463;H01L21/683;

  • 国家 DE

  • 入库时间 2022-08-24 22:17:17

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