首页> 外国专利> A board processing device and a board processing method provided with a board holding device and a board holding device.

A board processing device and a board processing method provided with a board holding device and a board holding device.

机译:电路板处理装置和电路板加工方法,包括板保持装置和板保持装置。

摘要

A substrate holding apparatus which can enhance the efficiency of processing of a substrate, such as a wafer (W), is disclosed. The substrate holding apparatus for holding a substrate and rotating the substrate, includes: rollers (11a, 11b) capable of contacting a periphery of the substrate; a roller rotating mechanism (12) configured to rotate the rollers; and eccentric shafts (13a, 13b) coupling the rollers and the roller rotating mechanism, the eccentric shafts having first shaft portions (14a, 15b) and second shaft portions (15a, 15b), the second shaft portions being eccentric relative to the first shaft portions, the first shaft portions being secured to the roller rotating mechanism, and the rollers being secured to the second shaft portions, respectively.
机译:公开了一种可以提高诸如晶片(W)的衬底的处理效率的基板保持装置。 用于保持基板并旋转基板的基板保持装置包括:辊子(11a,11b),其能够接触基板的周边; 滚轮旋转机构(12)构造成旋转辊子; 和偏心轴(13a,13b)连接辊子和滚轮旋转机构,具有第一轴部分(14a,15b)和第二轴部分(15a,15b)的偏心轴,第二轴部分相对于第一轴偏心 部分,第一轴部分固定到辊旋转机构,并且辊子分别固定到第二轴部分。

著录项

  • 公开/公告号JP6974116B2

    专利类型

  • 公开/公告日2021-12-01

    原文格式PDF

  • 申请/专利权人 株式会社荏原製作所;

    申请/专利号JP20170208327

  • 发明设计人 柏木 誠;保科 真穂;

    申请日2017-10-27

  • 分类号H01L21/683;H01L21/304;

  • 国家 JP

  • 入库时间 2022-08-24 22:33:09

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