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A board processing device and a board processing method provided with a board holding device and a board holding device.
A board processing device and a board processing method provided with a board holding device and a board holding device.
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机译:电路板处理装置和电路板加工方法,包括板保持装置和板保持装置。
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摘要
A substrate holding apparatus which can enhance the efficiency of processing of a substrate, such as a wafer (W), is disclosed. The substrate holding apparatus for holding a substrate and rotating the substrate, includes: rollers (11a, 11b) capable of contacting a periphery of the substrate; a roller rotating mechanism (12) configured to rotate the rollers; and eccentric shafts (13a, 13b) coupling the rollers and the roller rotating mechanism, the eccentric shafts having first shaft portions (14a, 15b) and second shaft portions (15a, 15b), the second shaft portions being eccentric relative to the first shaft portions, the first shaft portions being secured to the roller rotating mechanism, and the rollers being secured to the second shaft portions, respectively.
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