首页> 外国专利> CURABLE RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, ELECTRONIC DEVICE, LAMINATED BOARD MATERIAL, ELECTRONIC COMPONENT ENCAPSULANT, AND METHOD FOR PRODUCING CURABLE RESIN

CURABLE RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, ELECTRONIC DEVICE, LAMINATED BOARD MATERIAL, ELECTRONIC COMPONENT ENCAPSULANT, AND METHOD FOR PRODUCING CURABLE RESIN

机译:可固化树脂,可固化树脂组合物,固化产物,电子器件,层压板材料,电子元件密封剂和生产可固化树脂的方法

摘要

A curable resin represented by general formula (1). In general formula (1), R1 each independently represent a monovalent substituent (alkyl group, alkoxy group, fluorine atom, etc.), m is 0-4, n is 0-40, and R2 each independently are a monovalent group including a polymerizable functional group.
机译:由通式(1)表示的可固化树脂。 在通式(1)中,R 1各自独立地表示一价取代基(烷基,烷氧基,氟原子等),M为0-4,n为0-40,并且每个单独的R 2是单价基团,包括一个单价基团 可聚合官能团。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号