首页> 外国专利> Curable imide resin, curable resin composition, method for producing curable imide resin, method for producing curable resin composition, cured product, and method for producing cured product

Curable imide resin, curable resin composition, method for producing curable imide resin, method for producing curable resin composition, cured product, and method for producing cured product

摘要

PROBLEM TO BE SOLVED: To provide a curable imide resin having active energy ray curability and capable of forming a resin film having excellent flexibility, a curable resin composition containing the curable imide resin, a cured product thereof, and a production method thereof. I will provide a. The curable imide resin of the present invention is curable by irradiation with active energy rays, and has an imide resin (a) having a divalent chain group and two or more carboxylic acid anhydride groups, and It is characterized in that a reactive compound (b) having a reactive group capable of reacting with a carboxylic acid anhydride group and an ethylenically unsaturated group is reacted as an essential raw material. The imide resin (a) has a hydroxyl group-containing compound (a1) having a chain group and two or more hydroxyl groups and having a number average molecular weight of 200 to 5,000, and an isocyanate compound having two or more isocyanate groups ( It is preferable to react a2) with the acid anhydride group-containing compound (a3) having two or more carboxylic acid anhydride groups as an essential raw material. [Selection diagram] None

著录项

  • 公开/公告号JP2020100719A

    专利类型发明专利

  • 公开/公告日2020.07.02

    原文格式PDF

  • 申请/专利权人 DIC株式会社;

    申请/专利号JP2018239460

  • 发明设计人 谷本 洋一;桑田 康介;

    申请日2018.12.21

  • 分类号

  • 国家 JP

  • 入库时间 2022-08-21 10:55:21

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