CERIA-BASED COMPOSITE FINE PARTICLE DISPERSION, METHOD FOR PRODUCING THE SAME, AND CERIA-BASED COMPOSITE FINE PARTICLE DISPERSION-CONTAINING POLISHING ABRASIVE GRAIN DISPERSION

摘要

PROBLEM TO BE SOLVED: To provide a ceria-based composite particle dispersion that can polish silica films, Si wafers, and difficult-to-process materials at high speed and at the same time achieve high surface accuracy.;SOLUTION: Provided is a ceria-based composite fine particle dispersion that contains a ceria-based composite fine particle with an average particle diameter of 5 to 500 nm having the following features. The ceria-based composite fine particle has a mother particle which is a ceria-based fine particle, a cerium-containing silica layer on the surface of the mother particle, and a child particle dispersed in the inside of the cerium-containing silica layer, and the mother particle and the child particle are mainly composed of crystalline ceria. When subjected to X-ray diffraction, only the crystalline phase of ceria is detected. The average diameter of the crystallite of the crystalline ceria measured by subjecting to X-ray diffraction is 3 to 300 nm. The average particle diameter of the child particle is 10 to 25 nm.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2021,JPO&INPIT