首页> 外国专利> MAIN BOARD WITH INTEGRATED TRUSTED PLATFORM MODULE FOR A COMPUTER DEVICE AND METHOD FOR PRODUCING A MAIN BOARD WITH INTEGRATED TRUSTED PLATFORM MODULE

MAIN BOARD WITH INTEGRATED TRUSTED PLATFORM MODULE FOR A COMPUTER DEVICE AND METHOD FOR PRODUCING A MAIN BOARD WITH INTEGRATED TRUSTED PLATFORM MODULE

机译:具有集成可信平台模块的主板,用于计算机设备和具有集成可信平台模块的主板的方法和方法

摘要

The present invention relates to a main board (4) for a computer device comprising a plurality of main board components (5) arranged on a first surface (11) of the main board (4), wherein further Trusted Platform Module, TPM, components (2, 3) are arranged on the first surface of the main board (4), wherein the TPM components (2, 3) are located in a predetermined area (10) of the main board (4), the predetermined area (10) being detachable from the main board (4) by means of a predetermined break line. Furher, the present invention relates to a method for producing a main board (4) with an integrated TPM (1), wherein the method comprises the following steps: producing a Printed Circuit Board, PCB; arranging a plurality of main board components (5) in a first area 13 of the PCB; arranging TPM components (3, 4) in a second area (14) of the PCB, the second area being a detachable predetermined area (10) of the main board (4); creating a predetermined breakline which at least partly surronds the predetermined area (10) by drilling a plurality of holes (7) forming a perforated line (9) which at least partially surrounds the predetermined area (10).
机译:本发明涉及一种用于计算机装置的主板(4),包括布置在主板(4)的第一表面(11)上的多个主板部件(5),其中,进一步可信的平台模块,TPM,组件(2,3)布置在主板(4)的第一表面上,其中TPM部件(2,3)位于主板(4)的预定区域(10),预定区域(10 )通过预定的断线从主板(4)可拆卸。 Furerh,本发明涉及一种用集成的TPM(1)制造主板(4)的方法,其中所述方法包括以下步骤:制造印刷电路板PCB;在PCB的第一区域13中布置多个主板部件(5);将TPM部件(3,4)布置在PCB的第二区域(14)中,第二区域是主板(4)的可拆卸的预定区域(10);通过钻孔,形成预定的断裂线,该预定断裂线通过钻孔形成多个孔(7),该孔(7)形成形成具有至少部分地围绕预定区域(10)的穿孔线(9)。

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