MANUFACTURING METHOD OF POLYIMIDE COMPOSITE FILM HAVING LOW DIELECTRIC LOSS AND FLEXIBLE CIRCUIT BOARD USING THEM

摘要

The present invention relates to a method for manufacturing a polyimide composite film having low dielectric loss characteristics and a flexible circuit board using the polyimide composite film prepared therefrom. The present invention mixes silica particles obtained through a sol-gel process under conditions of minimized moisture content during the polyimide film production process, and uses a weak acid without the use of acid or alkali required in a conventional sol-gel process. By containing silica particles obtained by controlling loss can be reduced.