A film-form baking material, and a film-form baking material having a support sheet

摘要

The present invention provides a film-like sintered material (1) containing sinterable metal particles (10) and a binder component (20), wherein the content of the sinterable metal particles (10) is 15 to 98% by mass, and the binder component (20) The content is 2 to 50% by mass, the tensile modulus at 60°C is 4.0 to 10.0 MPa, and the elongation at break at 60°C is 500% or more, the film-like sintered material (1), and sinterable metal particles and a binder component. A film-form baking material comprising: a film-form baking material (1) and a support sheet (2) provided on at least one of the film-form baking material; a2) is smaller than the adhesive force a1 of the film-like fired material to the semiconductor wafer, the adhesive force a1 is 0.1 N/25 mm or more, and the adhesive force a2 is 0.1 N/25 mm or more 0.5 N /25 mm or less, providing a film-like fired material having the support sheet.