POLISHING PAD, AND POLISHING METHOD USING SAME

摘要

There are provided a polishing pad and a polishing method using the same that are useful for removing the surface waviness of a curved resin-painted surface at a high polishing removal rate. A polishing pad (10) according to one aspect of the present invention includes a layer having a polishing surface (30). The layer having the polishing surface (30) has a sparse and dense structure in which a proportion of a sparse portion of the polishing surface (30) is 52% or more and 96% or less, and is composed of a sheet material having an A hardness of 70 or more measured according to JIS K 6253.