Inorganic substrate / engineering plastic laminate with protective film, stack of laminate, storage method of laminate, and transportation method of laminate

摘要

An engineering plastic film is temporarily supported on an inorganic substrate, and an electronic device is fabricated by finely processing an engineering plastic film, and is used for a method of manufacturing a flexible electronic device by peeling off an inorganic substrate. Engineering plastic / protective layer of inorganic substrate.Inorganic substrateEngineering plastic filmAdhesive layer of protective filmProtective film substrateIn an inorganic substrate / engineering plastic film stack with protective film in this orderAdhesion strength FB by 90 degree delamination method between inorganic substrate and engineering plastic filmThe adhesion strength FP of the engineering plastic film and the protective film by 90 degree peeling method isCombination of FPThe surface roughness Ra of the protective film substrate opposite to the adhesive layer is 0.02 μ M μ In the range of M, an inorganic substrate / an engineered plastic film stack having a protective film having good storage, handling and transport properties is obtained.