Evaluation method of defect detection sensitivity of semiconductor substrate for evaluation and inspection device using the same

摘要

It is necessary to quantitatively evaluate the defect detection sensitivity of an inspection device that detects defects on a semiconductor substrate using a mirror electron image and guarantee its performance. The size and position of the accidentally formed defects were random, and such quantitative evaluation was difficult. The evaluation semiconductor substrate 101 for evaluating the defect detection sensitivity of the inspection device has a plurality of first indentations 104, and the first indentation uses an indenter having a predetermined hardness and shape on the evaluation semiconductor substrate. It is formed by pushing with the pushing load of 1. Further, the defect detection sensitivity of the inspection device is obtained by acquiring mirror electron images of the plurality of first indentations of the evaluation semiconductor substrate and calculating the defect detection rates of the plurality of first indentations in the acquired mirror electron images. To evaluate.