HALF-LEADER TRADE-ON-HALF-LEADER TRANSPORT PACKAGE AND PROCEDURE FOR ITS MANUFACTURING

摘要

Semiconductor assembly (100, 500) comprising:a first semiconductor substrate (110, 510) with a first main surface (110A, 510A) and a second main surface (110B, 510B);a second semiconductor substrate (150, 550) with a first main surface (150A, 550A) and a second main surface (150B, 550B), with the first main surface (110A, 550A) of the first semiconductor substrate (110, 550) facing the second main surface (150B, 550B) of the second semiconductor substrate (150, 550);a large number of first electrodes (120) placed on the first main surface (110A, 550A) of the first semiconductor substrate (110, 550);a multitude of second electrodes (160) placed on the second main surface (150B, 550B) of the second semiconductor substrate (150, 550);an electrical conductive layer placed between the first semiconductor substrate (110, 510) and the second semiconductor substrate (150, 550) perforated with holes (130, 530), with one first electrode (120), one hole (130H, 530H) and one second electrode (160) aligned with each other and the first electrodes(120) and the second electrodes (160) are electrically connected through the holes (130H, 530H); anda functional test electrode (530E) electrically connected to the conductive layer (130, 530).