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HALF-TIME RULES USING EDGE STOCKING AND MANUFACTURING PROCEDURES
HALF-TIME RULES USING EDGE STOCKING AND MANUFACTURING PROCEDURES
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机译:使用边缘库存和制造程序的半场规则
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摘要
Semiconductor assemblies and packages using edge stacking and associated systems and methods are disclosed herein. A semiconductor package may include (1) a base substrate having a base surface, (2) one or more dies attached over the base surface, and (3) a mold material encapsulating the base substrate and the one or more dies. The package may further include connectors on a side surface thereof, wherein the connectors are electrically coupled to the base substrate and/or the one or more dies. The connectors may be further configured to electrically couple the package to one or more neighboring semiconductor packages and/or electrical circuits.
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