首页> 外国专利> BISMUTH FERRITE FILM MATERIAL, METHOD FOR INTEGRALLY PREPARING BISMUTH FERRITE FILM ON SILICON SUBSTRATE AT LOW TEMPERATURE, AND APPLICATION

BISMUTH FERRITE FILM MATERIAL, METHOD FOR INTEGRALLY PREPARING BISMUTH FERRITE FILM ON SILICON SUBSTRATE AT LOW TEMPERATURE, AND APPLICATION

机译:铋铁氧体薄膜材料,在低温下在硅衬底上一体地制备铋铁氧体薄膜的方法,以及应用

摘要

Disclosed in the present invention are a bismuth ferrite film material, a method for integrally preparing a bismuth ferrite film on a silicon substrate at a low temperature, and an application. The method comprises: under the condition of 300-400℃, a bottom electrode, a buffer layer, and a bismuth ferrite film being sequentially subjected to magnetron sputtering on the surface of a base body from bottom to top; reducing the temperature to the room temperature; a top electrode being subjected to magnetron sputtering on the surface of the bismuth ferrite film, and the buffer layer being made of conductive oxide which can be matched with bismuth ferrite lattices and is of a perovskite structure. According to the present invention, the temperature for preparing the bismuth ferrite film material can be reduced to 450℃ or below, and the bismuth ferrite film material has high polarization strength.
机译:本发明公开了一种铋铁氧体薄膜材料,一种用于在低温下在硅衬底上一体地制备铋铁氧体膜的方法,以及应用。 该方法包括:在300-400℃的条件下,底部电极,缓冲层和铋铁氧体薄膜被顺序地在基体的表面上依次进行磁控溅射; 将温度降低到室温; 在铋铁氧体膜的表面上进行磁控管溅射的顶电极,并且缓冲层由导电氧化物制成,其可以与铁氧体格子匹配并且是钙钛矿结构。 根据本发明,制备铋铁氧体薄膜材料的温度可以降低至450℃或更低,并且铋铁氧体薄膜材料具有高偏振强度。

著录项

  • 公开/公告号WO2021208276A1

    专利类型

  • 公开/公告日2021-10-21

    原文格式PDF

  • 申请/专利权人 OUYANG JUN;

    申请/专利号WO2020CN101680

  • 发明设计人 NIU MIAOMIAO;ZHU HANFEI;

    申请日2020-07-13

  • 分类号H01L41/316;

  • 国家 CN

  • 入库时间 2022-08-24 21:51:56

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号