Wire feeding device and wire feeding method

摘要

The present invention relates to a wire feeding device for conveying wire and a method for feeding wire using the wire feeding device, in particular for a thermal bonding device, which can be actuated by a feeding drive and to transmit a driving motion by friction It has at least one drive element which can be arranged with respect to the wire being guided through the wire feeding device by applying a contact pressure. According to the invention, an actuator coupled to at least one drive element and capable of being controlled by a controller using a measured value for the contact pressure is provided for variably setting the contact pressure acting on the wire.