Scrivener method for semiconductor processing objects

摘要

PROBLEM TO BE SOLVED: To provide an effective and rapid method of laser processing for separating semiconductor devices formed on hard and brittle substrates with one process.;SOLUTION: The method comprises providing damage extending in a substrate layer along a scribing direction of a workpiece, where thermal stress is induced by two pulsed beams, comprising at least first and second pulses. The first pulse forms a heat accumulated zone, which makes absorption of the second pulse efficient, generating a sufficient heat gradient to produce mechanical failures and mechanically separating the workpiece.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2020,JPO&INPIT