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A method for double-sided grinding of workpieces and a device for double-sided grinding of workpieces
A method for double-sided grinding of workpieces and a device for double-sided grinding of workpieces
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机译:一种双面研磨工件的方法和用于双面研磨工件的装置
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摘要
The method for double-side polishing of a workpiece of the present invention includes a pre-polishing index calculation step of calculating an index Xp for a workpiece subjected to double-side polishing after double-side polishing in a previous batch, and a predetermined predictive formula, a target polishing time calculation step of calculating a target polishing time in In addition, the double-sided polishing apparatus for a workpiece according to the present invention comprises: a measurement unit for measuring the thickness of the workpiece subjected to the double-side polishing after double-side polishing in the previous batch; a first calculation unit for calculating the index Xp; A second calculation unit for calculating the target polishing time Tt in the current batch by using the prediction equation of
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