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Instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications

机译:用于在高温过程应用中获取测量参数的仪器基底装置

摘要

An apparatus includes a substrate, a nested enclosure assembly including an outer enclosure and an inner enclosure, wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses at least the electronic assembly. An insulating medium is disposed within a cavity between the outer surface of the inner enclosure and the inner surface of the outer enclosure and the system includes a sensor assembly communicatively coupled to the electronic assembly. The sensor assembly includes one or more sensors that are configured to acquire one or more measurement parameters at one or more locations of the substrate. The electronic assembly is configured to receive the one or more measurement parameters from the one or more sensors.
机译:装置包括基板,嵌套外壳组件包括外壳和内部外壳,其中,外壳包围内部外壳,并且内部外壳至少包围电子组件。 绝缘介质设置在内部外壳的外表面和外壳的内表面之间的腔内,并且该系统包括通信地耦合到电子组件的传感器组件。 传感器组件包括一个或多个传感器,该传感器被配置为在基板的一个或多个位置处获取一个或多个测量参数。 电子组件被配置为从一个或多个传感器接收一个或多个测量参数。

著录项

  • 公开/公告号US11150140B2

    专利类型

  • 公开/公告日2021-10-19

    原文格式PDF

  • 申请/专利权人 KLA-TENCOR CORPORATION;

    申请/专利号US201615277753

  • 发明设计人 MEI SUN;VAIBHAW VISHAL;

    申请日2016-09-27

  • 分类号G01K1/20;G01K1/02;G01K13;G01K7/02;G01K7/16;G01L9/02;G01T1/16;G01T7;

  • 国家 US

  • 入库时间 2024-06-14 22:14:37

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