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TAPE FOR ELECTRICAL CIRCUITS WITH ROSE-GOLD CONTACT PADS AND METHOD FOR MANUFACTURING SUCH A TAPE
TAPE FOR ELECTRICAL CIRCUITS WITH ROSE-GOLD CONTACT PADS AND METHOD FOR MANUFACTURING SUCH A TAPE
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机译:带玫瑰金接触垫的电路和制造此类胶带的方法
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摘要
A tape for manufacturing an electrical circuit with electrical contact pads, comprising:- a flexible dielectric substrate (4),- a copper foil (10) covering at least partially the dielectric substrate (4), the copper foil (10) having an internal face (18) facing the dielectric substrate (4), and an external face (19) opposite the internal face (18),- an intermediate layer comprising at least a nickel-based layer covering at least partially the external face (19) of the copper foil (10),;A gold-copper alloy layer (13) is deposited on the intermediate layer.;A method for manufacturing an electrical circuit, comprising providing a tape with conductive pads, and plating pads with a layer of gold-copper alloy electrodeposited from an electro-deposition solution.
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