Polyimide, crosslinked polyimide, adhesive film, laminate, cover lay film, copper foil with resin, metal clad laminate, circuit board and multilayer circuit board

摘要

Problem to be solved: to improve the dielectric characteristic of the adhesive layer using polyimide which is made of aliphatic diamine as the raw material, and to reduce the transmission loss of the high-frequency signal more effectively.A total diamine residue contains 50 to 95 mol% of the residues derived from the dimeric amine composition, and b) the total diamine residue contains 5 to 50 mol% of the residues derived from the diamine compound of formula (1), and C) for all tetracarboxylic acid residues Polyimide containing residues derived from benzophenone tetracarboxylic dianhydride within 10 to 90 mol%.No selection