首页> 外国专利> 2 Two dimensional2D material based line conductive layer contact structure electronic device including the same and method of manufacturing electronic device

2 Two dimensional2D material based line conductive layer contact structure electronic device including the same and method of manufacturing electronic device

机译:2二维2D基于材料的线路导电层接触结构电子设备包括相同和制造电子设备的方法

摘要

Disclosed are a two-dimensional material-based interconnection conductive layer contact structure, an electronic device including the same, and a manufacturing method thereof. An example of the disclosed electronic device is a 2D material-based field effect transistor, which includes a substrate, first to third 2D material layers formed on the substrate, an insulating layer formed on the first 2D material layer, and the second 2D material layer. a source electrode formed on the material layer, a drain electrode formed on the third 2D material layer, and a gate electrode formed on the insulating layer. The first 2D material layer is a 2D material layer exhibiting semiconductor properties, and the second and third 2D material layers are metallic 2D material layers. The first 2D material layer may include a first channel layer of a 2D material and a second channel layer of a 2D material. The first 2D material layer may partially overlap the second and third 2D material layers.
机译:公开了一种基于二维材料的互连导电层接触结构,包括该的电子设备及其制造方法。 所公开的电子设备的示例是基于2D材料的场效应晶体管,其包括基板,第一至形成在基板上的第三2D材料层,形成在第一2D材料层上的绝缘层和第二2D材料层。 。 在材料层上形成的源电极,在第三2D材料层上形成的漏极,以及形成在绝缘层上的栅电极。 第一2D材料层是表现出半导体性能的2D材料层,第二和第三2D材料层是金属2D材料层。 第一2D材料层可包括2D材料的第一通道层和2D材料的第二沟道层。 第一2D材料层可以部分地与第二和第三2D材料层重叠。

著录项

  • 公开/公告号KR20210121948A

    专利类型

  • 公开/公告日2021-10-08

    原文格式PDF

  • 申请/专利权人 삼성전자주식회사;

    申请/专利号KR20200039431

  • 发明设计人 설민수;신현진;유민석;이민현;

    申请日2020-03-31

  • 分类号H01L21/441;H01L21/02;H01L29/417;H01L29/45;H01L29/66;H01L29/786;

  • 国家 KR

  • 入库时间 2022-08-24 21:34:54

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