COUPLING ALIGNMENT DEVICE AND METHOD FOR LASER CHIP AND SILICON-BASED OPTOELECTRONIC CHIP

摘要

A coupling alignment device and method for a laser chip (1) and a silicon-based optoelectronic chip (2). The device comprises a transfer mold (3); the transfer mold (3) comprises a substrate (34), first protrusions (31), and second protrusions (32), wherein the first protrusions (31) are provided with through holes (33) and are used for being clamped into first recesses (11) in the laser chip (1); and the second protrusions (32) are used for being clamped into second recesses (21) in the silicon-based optoelectronic chip (2). The method comprises: etch the first recesses (11) in the laser chip (1); etch the second recesses (21) in the silicon-based optoelectronic chip (2); etch the first protrusions (31), the second protrusions (32), and the through holes (33) in the transfer mold (3); a flip-chip suction nozzle (4) is fixedly connected to the transfer mold (3), the transfer mold (3) is in alignment contact with the laser chip (1), and the flip-chip suction nozzle (4) suctions the laser chip (1) by means of the through holes (33); and assemble the laser chip (1) on the silicon-based optoelectronic chip (2) by means of the alignment contact between the transfer mold (3) and the silicon-based optoelectronic chip (2). The coupling alignment technology of the coupling alignment device and method is high in precision, high in efficiency, low in costs, and can achieve large-scale and mass production.