Chemical Mechanical Polishing Pad Stiffness Control by Controlling Wetting of Back Layer

摘要

A polishing pad for a chemical mechanical polishing apparatus includes a polishing layer having a polishing surface, and a backing layer formed of a fluid permeable material. The backing layer includes a lower surface configured to be secured to the platen, and an upper surface secured to the abrasive layer, the lower surface and the upper surface being sealed. The first seal circumferentially seals the edge of the back surface layer, and the second seal seals and separates the back surface layer into a first area and a second area surrounded by the first area.