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Array board, method of manufacturing array board, array board motherboard, display panel and display device

机译:阵列板,制造阵列板的方法,阵列板主板,显示面板和显示装置

摘要

Provided are an array substrate, a method for manufacturing an array substrate, an array substrate motherboard, a display panel, and a display device. The array substrate includes a display area (aa) and a binding area (bb) located outside the display area (aa). The array substrate has a binding electrode (1) located in the binding region (bb) and separated from the outer edge of the binding region (bb), one end of which is electrically connected to the binding electrode (1), and the other end of which is the binding region (b). It further includes an electrostatic shielded wire (2) that extends to the outer edge of bb) and has a resistivity greater than that of the binding electrode (1). It is advantageous for reducing the damage caused by static electricity to the internal structure of the array structure and the internal structure of the array substrate.
机译:提供是阵列基板,用于制造阵列基板,阵列基板主板,显示面板和显示装置的方法。 阵列基板包括位于显示区域(AA)外部的显示区域(AA)和绑定区域(BB)。 阵列基板具有位于结合区域(BB)中的粘合电极(1),并与粘合区域(BB)的外边缘分离,其一端电连接到粘合电极(1),另一端电连接 其结束是结合区域(b)。 它还包括延伸到BB的外边缘的静电屏蔽线(2),并且具有大于粘合电极(1)的电阻率。 有利的是减少由静电引起的损坏到阵列结构的内部结构和阵列基板的内部结构。

著录项

  • 公开/公告号JP2021526658A

    专利类型

  • 公开/公告日2021-10-07

    原文格式PDF

  • 申请/专利号JP20190559760

  • 发明设计人 程 鴻飛;

    申请日2019-04-26

  • 分类号G09F9/30;G09F9;H01L51/50;H01L27/32;H01L21/822;H01L27/04;H01L29/786;

  • 国家 JP

  • 入库时间 2022-08-24 21:31:35

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