首页>
外国专利>
Component carrier with high passive intermodulation performance
Component carrier with high passive intermodulation performance
展开▼
机译:具有高无源互调性能的组件载体
展开▼
页面导航
摘要
著录项
相似文献
摘要
A component carrier which includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure, and electrically conductive wiring structures being part of the at least one electrically conductive layer structure, wherein a value of the passive intermodulation for signals propagating along the electrically conductive wiring structures is less than −153 dBc.
展开▼