PROCESS FOR MANUFACTURING A PIEZOELECTRIC STRUCTURE FOR A RADIOFREQUENCY DEVICE, WHICH STRUCTURE CAN BE USED TO TRANSFER A PIEZOELECTRIC LAYER, AND PROCESS FOR TRANSFERRING SUCH A PIEZOELECTRIC LAYER

摘要

A process for manufacturing a piezoelectric structure (10) for a radiofrequency device, said process being characterized in that it comprises providing a substrate of piezoelectric material (20), providing a carrier substrate (100), providing a dielectric bonding layer (1001) on the substrate of piezoelectric material (20), a step (1') of joining the substrate of piezoelectric material (20) to the carrier substrate (100) via the dielectric bonding layer (1001), and a thinning step (2') for forming the piezoelectric structure (10), which consists of a layer of piezoelectric material (200) joined to a carrier substrate (100) via the dielectric bonding layer (1001).