FOD FOD ADHESIVE FILM AND SEMICONDUCTOR PACKAGE COMPRISING THEREOF

摘要

The present invention relates to a FOD adhesive film and a semiconductor package including the same. The FOD adhesive film according to the present invention has an adhesive layer having a probe tack measurement value of 15 gf or less and a melt viscosity of 2000 to 9000 Pa s at 110 ° C. It has the effect of significantly reducing the defect rate in the process.